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产品/Product

ASM Dek 高精度锡膏印刷机

     ØASM Dek Printer 系列/ E-Dek Printer series

ASM Dek Printer series / E-Dek Printer系列

lDEK Printer 提供市场的全新解决方案 如既往的最佳性能与品质

DEK Printer offers new solutions for the market – always best performance and quality

l源自高端传承,引领高效未来”超过50年的高端经验!

From high-end heritage, leading to an efficient future–more than 50 years of high-end experience!

l先进的DEK印刷解决方案能够应对各类复杂生产流程,无论是最高产能要求,最高品质要求以及最高灵活性要求,DEK总是您最佳的选择。

Advanced DEK printing solutions can handle a variety of complex production processes. Regardless of the highest productivity requirements, the highest quality requirements and the highest flexibility requirements.

DEK Printer is always the best choice for you.

lE by DEK将这领先的解决方案以及经验带入此细分市场,并且为客户考虑得更多:

E by DEK brings this leading solution and experience to this segment and considers more for customers:

lE 性能不仅是“够用就好”

E Performance - not just "good enough"

lE 质量应对间距印刷

E Quality - Easily deal with narrow-pitch printing

lE 灵活支持所有生产应用

E Flexible – supports all production applications

E 性能 / E performance

8 印刷周期 / 8-second print cycle

最佳重覆精度 / Best repeat accuracy

快速换线操作 / Quick changeover operation

E 质量 / E quality

质量组成部件 / High-quality components

模组化设计 / Modular design

轻松应对细间距印刷 / Easily handle fine-pitch printing

E 灵活 / E Flexible

支持多种操作语言 / Support multiple operating languages

支持所有钢网尺寸 / Supports all steel mesh sizes

专利的灵活夹持系统 / Patented flexible clamping system

 

SIPLACE TX Series

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE TX Series

lSIPLACE TX Series
üDual-sided machine
ü1 or 2 gantries
üSIPLACE SpeedStar (CP20P), MultiStar (CPP), TwinStar (TH)
üMachine size (L x W x H): 1.00m x 2.35m x 1.45m
üUp to 78.000 cph
ü22µm @ 3 s (25 µm with CP20P)
üPCB size45 x 45 mm to 375 x 260 mm (dual lane)

           45 x 45 mm to 375 x 460 mm (dual as single lane)

üComponent range0201 metric(008004)–45x55 mm
üComponent supplyup to 80 x 8 mm tapesJEDEC traySIPLACE Bulk Feeder
üTypical power consumption: 1,9 kW
 
 

SIPLACE X Series

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE X Series

lSIPLACE X Series

üThe fastest placement machine in the world with up to 150,000 components per hour

üTop flexibility, component range and setup capability with our revolutionary 3 head concept.

üPerformance increase by adding gantries according to your needs

üBest proven 0201 (metric) solution in the industry.

uSIPLACE X2 SFlexible / Performance - 64,000 components/hour

uSIPLACE X3 SFlexible High-Speed / Performance - 94,500 components/hour

uSIPLACE X4 SHigh-Speed / Performance - 125,000 components/hour

uSIPLACE X4i SUltra-High-Speed Performance - 150,000 components/hour

 

SIPLACE Di-Series

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE Di-Series

lSIPLACE Di-Series

üHigh quality SMT package at a reasonable price

üCovers a broad range of components (including 01005)

üSuitable for mid-volume production with excellent end-of-line capabilities

uSIPLACE D1iHigh Flexibility - 15,000 components/hour

uSIPLACE D2iHigh-speed production - 31,000 components/hour

uSIPLACE D4iVery-high-speed production - 66,000 components/hour

 

Wafer Copper Pillar Remove System

Wafer Copper Pillar Remove System

lDetect wafer warpage and real time change milling module.
lSearch defect die by on site inspector or catch defect data from mapping or SECS/GEM.
lAccuracy control milling module height :≤±5um
lFit for 8” 12” wafer.

SIPLACE TX micron-Semi

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE TX micron
üMachine Configuration2 gantries
üPlacement headsSpeedStar (CP20M2) / Multistar (CPP)
üBenchmarkUp to 78,000 cph with SpeedStar
üComponent range [LxWxH]0201 metric up to 15 mm x 15 mm x 8,5 mm
üAccuracy25 / 20 /15 µm* @ 3 σ
üBoard sizeDual conveyor: 45 x 45 mm to 375 x 260 mm / Dual as Single   45 x 45 mm to 375 x 460 mm
üComponent Supplyup to 80 x 8 mm tapes, JEDEC tray, Bulk Feeder
üClean Room( Class 10000 / ISO 7 Standard ) / ( Class 1000 / ISO 6 Optional / under development )
üCertificationCE, Semi S2 / S8
üPower ConsumptionTypical: 1,9 kW including vacuum pump
üMachine Dimensions (LxWxH)1,00m x 2,23 m x 1,45m

SIPLACE TX Series-Semi

SIPLACE TX Series-Semi

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE TX Series-Semi

lSIPLACE TX Series
üDual-sided machine
ü1 or 2 gantries
üSIPLACE SpeedStar (CP20P), MultiStar (CPP), TwinStar (TH)
üMachine size (L x W x H): 1.00m x 2.35m x 1.45m
üUp to 78.000 cph
ü22µm @ 3 s (25 µm with CP20P)
üPCB size45 x 45 mm to 375 x 260 mm (dual lane)

           45 x 45 mm to 375 x 460 mm (dual as single lane)

üComponent range0201 metric(008004)–45x55 mm
üComponent supplyup to 80 x 8 mm tapesJEDEC traySIPLACE Bulk Feeder
üTypical power consumption: 1,9 kW
 
 
SIPLACE X Series-Semi

SIPLACE X Series-Semi

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE X Series-Semi

lSIPLACE X Series

üThe fastest placement machine in the world with up to 150,000 components per hour

üTop flexibility, component range and setup capability with our revolutionary 3 head concept.

üPerformance increase by adding gantries according to your needs

üBest proven 0201 (metric) solution in the industry.

uSIPLACE X2 SFlexible / Performance - 64,000 components/hour

uSIPLACE X3 SFlexible High-Speed / Performance - 94,500 components/hour

uSIPLACE X4 SHigh-Speed / Performance - 125,000 components/hour

uSIPLACE X4i SUltra-High-Speed Performance - 150,000 components/hour

 

SIPLACE Di-Series-Semi

SIPLACE Di-Series-Semi

ASM Siplace 高速机系列/ E-Siplace中速机系列-SIPLACE Di-Series-Semi

lSIPLACE Di-Series

üHigh quality SMT package at a reasonable price

üCovers a broad range of components (including 01005)

üSuitable for mid-volume production with excellent end-of-line capabilities

uSIPLACE D1iHigh Flexibility - 15,000 components/hour

uSIPLACE D2iHigh-speed production - 31,000 components/hour

uSIPLACE D4iVery-high-speed production - 66,000 components/hour

 

ASM Dek 高精度锡膏印刷机-Semi

ASM Dek 高精度锡膏印刷机-Semi

     ØASM Dek Printer 系列/ E-Dek Printer series-Semi

ASM Dek Printer series / E-Dek Printer系列-Semi

lDEK Printer 提供市场的全新解决方案 如既往的最佳性能与品质

DEK Printer offers new solutions for the market – always best performance and quality

l源自高端传承,引领高效未来”超过50年的高端经验!

From high-end heritage, leading to an efficient future–more than 50 years of high-end experience!

l先进的DEK印刷解决方案能够应对各类复杂生产流程,无论是最高产能要求,最高品质要求以及最高灵活性要求,DEK总是您最佳的选择。

Advanced DEK printing solutions can handle a variety of complex production processes. Regardless of the highest productivity requirements, the highest quality requirements and the highest flexibility requirements.

DEK Printer is always the best choice for you.

lE by DEK将这领先的解决方案以及经验带入此细分市场,并且为客户考虑得更多:

E by DEK brings this leading solution and experience to this segment and considers more for customers:

lE 性能不仅是“够用就好”

E Performance - not just "good enough"

lE 质量应对间距印刷

E Quality - Easily deal with narrow-pitch printing

lE 灵活支持所有生产应用

E Flexible – supports all production applications

E 性能 / E performance

8 印刷周期 / 8-second print cycle

最佳重覆精度 / Best repeat accuracy

快速换线操作 / Quick changeover operation

E 质量 / E quality

质量组成部件 / High-quality components

模组化设计 / Modular design

轻松应对细间距印刷 / Easily handle fine-pitch printing

E 灵活 / E Flexible

支持多种操作语言 / Support multiple operating languages

支持所有钢网尺寸 / Supports all steel mesh sizes

专利的灵活夹持系统 / Patented flexible clamping system

 

Epoxy Die bonder-8"~12" wafer 全自动

 

Ø8~12Epoxy Bonder / 8”~12” Epoxy Bonder
 
l对应8”~12”寸晶圆

Correspond to 8 "~ 12" inch wafer.

 

l自动,搭载mapping系统

Fully automatic, equipped with mapping system.

 

l高速高精度 (cycle time=0.5sec, accuracy= ±25um)

High speed, high accuracy (cycle time=0.5sec, accuracy= ±25um).



高精度 CIS Bonder / High precision CIS Bonder

 

 

Ø高精度 CIS Bonder / High precision CIS Bonder

 

  
l特殊轨道设计及视觉对位系统,专用於CIS (CMOS image sensor )制程

 Special track design and visual alignment system, dedicated to CIS (CMOS image sensor) process.

 

l精度( accuracy= ±5um)

 High precision (accuracy = ± 5um).

 

  
l应用於手机摄像模组3D双镜头封装制程

Can be applied to mobile phone camera module, 3D dual lens packaging process.

 

Die Sorter-6"~12" wafer 半自动

 

Ø8~12寸晶圆系列
 
l半自动,可对应6~12晶圆及2~4tray盘或JEDEC tray.

Semi-automatic, correspond to 8~ 12-inch wafer and 2 to 4-inch tray or JEDEC tray.

 
l弹性的tray放置系统,可快速更换成不同种类tray.

Highly flexible tray placement system that can be quickly replaced into different types of tray.

 
l适用产品变化多,以及非标准的晶片取放制程,如光学玻璃,PCBQFN等等.

Applicable product changes, and non-standard wafer pick and place process, such as optical glass, PCB, QFN, etc.

 

Die Sorter-8寸 wafer 系列

 

Ø6~8寸晶圆系列 / 6”~8" wafer series
lRushes A8
n自动,可对应6~8晶圆及2~4tray

Fully automatic, correspond to 6 ~ 8-inch wafer and 2 to 4-inch tray.

n应用於一般裸晶(bare die)及驱动IC(Driver IC)

Used in the general bare die and Driver IC.

 

n高速产出(cycle time =0.4 sec)

High speed output (cycle time = 0.4 sec)

 

lRushes S8
n半自动,可对应6~8晶圆及2~4tray盘或JEDEC tray

Semi-automatic, correspond to 6 ~ 8 inch wafer and 2 to 4-inch tray or JEDEC tray.

 

n高弹性的tray放置系统,可快速更换成不同种类tray

Highly flexible tray placement system that can be quickly replaced into different types of tray.

 

n适用产品变化,以及非标准的晶片取放制程,如光学玻璃,PCBQFN等等

Applicable to product changes, and non-standard wafer transfer process, such as optical glass, PCB, QFN, etc.

 

 

Die Sorter-12" wafer 全自动

Ø12寸晶圆系列 / 12”wafer series
 
l全自动,可对应8~12晶圆及2~4tray

Fully automatic, correspond to 8 ~ 12 inch wafer and 2 to 4 inch tray.

 

l应用於一般裸晶(bare die)及驱动IC(Driver IC)

Used in the general bare die and Driver IC.

 

l高速产出(cycle time =0.45 sec)

High speed output (cycle time = 0.45 sec).

 

线材自动化设备 -电源线(Power cord)全自动生产线

 
Ø线材自动化设备
-电源线(Power cord)全自动生产线
Wire automation equipment - power cord (Power cord) automatic production line
Ø分为ABC/ Divided into ABC segment
lA: 线卷送线,裁切长度,剥皮,分线,打

A section: wire feed line, cutting length, peeling, sub-line, hit the terminal.

 

lB:传送,插入模具,射出,脱

B section: transfer, insert the mold, injection, stripping.

 

lC: 电测,分类,包装

C section: electrical measurement, classification, packaging.

线材自动化设备应用

 
Ø线材自动化设备应用/Application of wire automation equipment
 
Ø3C产品、车用电子、均为线材之应用场合 / All wire cable applications for 3C products, automotive electronics.
l电子产品内部线

Interior wire cable of electronic product.

 

l电子产品外部线

External wire cable of electronic product.

 

l工业用讯号(大数据、视觉讯号)传输线销售

Industrial signal (large data, visual signal) transmission line sales.

 

Ø目前人力为主要生产模式,产线自动化有益於企业提高产能,品质稳定 / The current manpower as the main mode of production, production line automation is conducive to enterprises to improve production capacity, quality and stability.

手机摄像模组(CCM)封装设备

 

Ø手机摄像模组(CCM)封装设备 / Mobile phone camera module (CCM) packaging equipment

 

Ø自行开发之ACIP制程 / Self-developed ACIP process

 

lAuto Clean Inspection Package 连线设备

 All in one, auto Clean Inspection Package equipment.

  

l组合晶片清洁,晶片检查,光学玻璃或Lens Holder封合等功能设备,建构全自动化封装线

 Combination die cleaning, die inspection, optical glass or Lens Holder sealing and other functional equipment, the construction of fully automated packaging line.

  

l最高洁净度及良率之架构

 The highest cleanliness and yield structure.

 

SFP+/QSFP/RJ45 Switch测试机

 

 

ØSFP+/QSFP/RJ45 Switch测试/ SFP+/QSFP/RJ45 Switch testing equipment.

 

l适用SFP+/QSFP/RJ45测试插头 、自动旋转插头

Applicable SFP + / QSFP / RJ45 test plug, automatic rotation test plug.

 

l以双CCD为位置定位依据,确保插头插入位置精准无误

Make sure the correct position based on double CCD, to ensure that the plug inserted position accurate and correct.

 

l自动寻找插座位置,减少程式设置时间及人员误动作机会

Automatically find the location of the socket, reduce the program set up time and staff malfunction.

 

l插头具自动溃缩设计,确保插头过行程造成的损坏

The plug is designed to avoid plug crushed by the stroke.

 

l可根据客户需求改变设计

According to customer needs to change the design.

 

视觉系统自动化设备客制

 
Ø视觉系统自动化设备 /Visual system automation equipment
l采用自主开发之视觉应用软体

Using self-developed visual application software.

 

l弹性化、客制化之功能整合

Flexible, customization of the functional integration.

 

l可应用於定位、量测、检查、辨识

Can be applied to positioning, measurement, inspection, identification etc...