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產品/Product

ASM Dek 高精度錫膏印刷機

     ØASM Dek Printer 系列/ E-Dek Printer series

ASM Dek Printer series / E-Dek Printer系列

lDEK Printer 提供市場的全新解決方案 如既往的最佳性能與品質

DEK Printer offers new solutions for the market – always best performance and quality

l源自高端傳承,引領高效未來”超過50年的高端經驗!

From high-end heritage, leading to an efficient future–more than 50 years of high-end experience!

l先進的DEK印刷解決方案能夠應對各類複雜生產流程,無論是最高產能要求,最高品質要求以及最高靈活性要求,DEK總是您最佳的選擇。

Advanced DEK printing solutions can handle a variety of complex production processes. Regardless of the highest productivity requirements, the highest quality requirements and the highest flexibility requirements.

DEK Printer is always the best choice for you.

lE by DEK將這領先的解決方案以及經驗帶入此細分市場,並且為客戶考慮得更多:

E by DEK brings this leading solution and experience to this segment and considers more for customers:

lE 性能不僅是“夠用就好”

E Performance - not just "good enough"

lE 質量應對間距印刷

E Quality - Easily deal with narrow-pitch printing

lE 靈活支持所有生產應用

E Flexible – supports all production applications

E 性能 / E performance

8 印刷週期 / 8-second print cycle

最佳重覆精度 / Best repeat accuracy

快速換線操作 / Quick changeover operation

E 質量 / E quality

質量組成部件 / High-quality components

模組化設計 / Modular design

輕松應對細間距印刷 / Easily handle fine-pitch printing

E 靈活 / E Flexible

支持多種操作語言 / Support multiple operating languages

支持所有鋼網尺寸 / Supports all steel mesh sizes

專利的靈活夾持系統 / Patented flexible clamping system

 

SIPLACE TX Series

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE TX Series

lSIPLACE TX Series
üDual-sided machine
ü1 or 2 gantries
üSIPLACE SpeedStar (CP20P), MultiStar (CPP), TwinStar (TH)
üMachine size (L x W x H): 1.00m x 2.35m x 1.45m
üUp to 78.000 cph
ü22µm @ 3 s (25 µm with CP20P)
üPCB size45 x 45 mm to 375 x 260 mm (dual lane)

           45 x 45 mm to 375 x 460 mm (dual as single lane)

üComponent range0201 metric(008004)–45x55 mm
üComponent supplyup to 80 x 8 mm tapesJEDEC traySIPLACE Bulk Feeder
üTypical power consumption: 1,9 kW
 
 

SIPLACE X Series

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE X Series

lSIPLACE X Series

üThe fastest placement machine in the world with up to 150,000 components per hour

üTop flexibility, component range and setup capability with our revolutionary 3 head concept.

üPerformance increase by adding gantries according to your needs

üBest proven 0201 (metric) solution in the industry.

uSIPLACE X2 SFlexible / Performance - 64,000 components/hour

uSIPLACE X3 SFlexible High-Speed / Performance - 94,500 components/hour

uSIPLACE X4 SHigh-Speed / Performance - 125,000 components/hour

uSIPLACE X4i SUltra-High-Speed Performance - 150,000 components/hour

 

SIPLACE Di-Series

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE Di-Series

lSIPLACE Di-Series

üHigh quality SMT package at a reasonable price

üCovers a broad range of components (including 01005)

üSuitable for mid-volume production with excellent end-of-line capabilities

uSIPLACE D1iHigh Flexibility - 15,000 components/hour

uSIPLACE D2iHigh-speed production - 31,000 components/hour

uSIPLACE D4iVery-high-speed production - 66,000 components/hour

 

Wafer Copper Pillar Remove System

Wafer Copper Pillar Remove System

lDetect wafer warpage and real time change milling module.
lSearch defect die by on site inspector or catch defect data from mapping or SECS/GEM.
lAccuracy control milling module height :≤±5um
lFit for 8” 12” wafer.

SIPLACE TX micron-Semi

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE TX micron
üMachine Configuration2 gantries
üPlacement headsSpeedStar (CP20M2) / Multistar (CPP)
üBenchmarkUp to 78,000 cph with SpeedStar
üComponent range [LxWxH]0201 metric up to 15 mm x 15 mm x 8,5 mm
üAccuracy25 / 20 /15 µm* @ 3 σ
üBoard sizeDual conveyor: 45 x 45 mm to 375 x 260 mm / Dual as Single   45 x 45 mm to 375 x 460 mm
üComponent Supplyup to 80 x 8 mm tapes, JEDEC tray, Bulk Feeder
üClean Room( Class 10000 / ISO 7 Standard ) / ( Class 1000 / ISO 6 Optional / under development )
üCertificationCE, Semi S2 / S8
üPower ConsumptionTypical: 1,9 kW including vacuum pump
üMachine Dimensions (LxWxH)1,00m x 2,23 m x 1,45m

SIPLACE TX Series-Semi

SIPLACE TX Series-Semi

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE TX Series-Semi

lSIPLACE TX Series
üDual-sided machine
ü1 or 2 gantries
üSIPLACE SpeedStar (CP20P), MultiStar (CPP), TwinStar (TH)
üMachine size (L x W x H): 1.00m x 2.35m x 1.45m
üUp to 78.000 cph
ü22µm @ 3 s (25 µm with CP20P)
üPCB size45 x 45 mm to 375 x 260 mm (dual lane)

           45 x 45 mm to 375 x 460 mm (dual as single lane)

üComponent range0201 metric(008004)–45x55 mm
üComponent supplyup to 80 x 8 mm tapesJEDEC traySIPLACE Bulk Feeder
üTypical power consumption: 1,9 kW
 
 
SIPLACE X Series-Semi

SIPLACE X Series-Semi

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE X Series-Semi

lSIPLACE X Series

üThe fastest placement machine in the world with up to 150,000 components per hour

üTop flexibility, component range and setup capability with our revolutionary 3 head concept.

üPerformance increase by adding gantries according to your needs

üBest proven 0201 (metric) solution in the industry.

uSIPLACE X2 SFlexible / Performance - 64,000 components/hour

uSIPLACE X3 SFlexible High-Speed / Performance - 94,500 components/hour

uSIPLACE X4 SHigh-Speed / Performance - 125,000 components/hour

uSIPLACE X4i SUltra-High-Speed Performance - 150,000 components/hour

 

SIPLACE Di-Series-Semi

SIPLACE Di-Series-Semi

ASM Siplace 高速機系列/ E-Siplace中速機系列-SIPLACE Di-Series-Semi

lSIPLACE Di-Series

üHigh quality SMT package at a reasonable price

üCovers a broad range of components (including 01005)

üSuitable for mid-volume production with excellent end-of-line capabilities

uSIPLACE D1iHigh Flexibility - 15,000 components/hour

uSIPLACE D2iHigh-speed production - 31,000 components/hour

uSIPLACE D4iVery-high-speed production - 66,000 components/hour

 

ASM Dek 高精度錫膏印刷機-Semi

ASM Dek 高精度錫膏印刷機-Semi

     ØASM Dek Printer 系列/ E-Dek Printer series-Semi

ASM Dek Printer series / E-Dek Printer系列-Semi

lDEK Printer 提供市場的全新解決方案 如既往的最佳性能與品質

DEK Printer offers new solutions for the market – always best performance and quality

l源自高端傳承,引領高效未來”超過50年的高端經驗!

From high-end heritage, leading to an efficient future–more than 50 years of high-end experience!

l先進的DEK印刷解決方案能夠應對各類複雜生產流程,無論是最高產能要求,最高品質要求以及最高靈活性要求,DEK總是您最佳的選擇。

Advanced DEK printing solutions can handle a variety of complex production processes. Regardless of the highest productivity requirements, the highest quality requirements and the highest flexibility requirements.

DEK Printer is always the best choice for you.

lE by DEK將這領先的解決方案以及經驗帶入此細分市場,並且為客戶考慮得更多:

E by DEK brings this leading solution and experience to this segment and considers more for customers:

lE 性能不僅是“夠用就好”

E Performance - not just "good enough"

lE 質量應對間距印刷

E Quality - Easily deal with narrow-pitch printing

lE 靈活支持所有生產應用

E Flexible – supports all production applications

E 性能 / E performance

8 印刷週期 / 8-second print cycle

最佳重覆精度 / Best repeat accuracy

快速換線操作 / Quick changeover operation

E 質量 / E quality

質量組成部件 / High-quality components

模組化設計 / Modular design

輕松應對細間距印刷 / Easily handle fine-pitch printing

E 靈活 / E Flexible

支持多種操作語言 / Support multiple operating languages

支持所有鋼網尺寸 / Supports all steel mesh sizes

專利的靈活夾持系統 / Patented flexible clamping system

 

Epoxy Die bonder-8"~12" wafer 全自動

 

Ø8~12Epoxy Bonder / 8”~12” Epoxy Bonder
 
l對應8”~12”吋晶圓

Correspond to 8 "~ 12" inch wafer.

 

l自動,搭載mapping系統

Fully automatic, equipped with mapping system.

 

l高速高精度 (cycle time=0.5sec, accuracy= ±25um)

High speed, high accuracy (cycle time=0.5sec, accuracy= ±25um).



高精度 CIS Bonder / High precision CIS Bonder

 

 

Ø高精度 CIS Bonder / High precision CIS Bonder

 

  
l特殊軌道設計及視覺對位系統,專用於CIS (CMOS image sensor )製程

 Special track design and visual alignment system, dedicated to CIS (CMOS image sensor) process.

 

l精度( accuracy= ±5um)

 High precision (accuracy = ± 5um).

 

  
l應用於手機攝像模組3D雙鏡頭封裝製程

Can be applied to mobile phone camera module, 3D dual lens packaging process.

 

Die Sorter-6"~12" wafer 半自動

 

Ø8~12吋晶圓系列
 
l半自動,可對應6~12晶圓及2~4tray盤或JEDEC tray.

Semi-automatic, correspond to 8~ 12-inch wafer and 2 to 4-inch tray or JEDEC tray.

 
l彈性的tray放置系統,可快速更換成不同種類tray.

Highly flexible tray placement system that can be quickly replaced into different types of tray.

 
l適用產品變化多,以及非標準的晶片取放製程,如光學玻璃,PCBQFN等等.

Applicable product changes, and non-standard wafer pick and place process, such as optical glass, PCB, QFN, etc.

 

Die Sorter-8吋 wafer 系列

 

Ø6~8吋晶圓系列 / 6”~8" wafer series
lRushes A8
n自動,可對應6~8晶圓及2~4tray

Fully automatic, correspond to 6 ~ 8-inch wafer and 2 to 4-inch tray.

n應用於一般裸晶(bare die)及驅動IC(Driver IC)

Used in the general bare die and Driver IC.

 

n高速產出(cycle time =0.4 sec)

High speed output (cycle time = 0.4 sec)

 

lRushes S8
n半自動,可對應6~8晶圓及2~4tray盤或JEDEC tray

Semi-automatic, correspond to 6 ~ 8 inch wafer and 2 to 4-inch tray or JEDEC tray.

 

n高彈性的tray放置系統,可快速更換成不同種類tray

Highly flexible tray placement system that can be quickly replaced into different types of tray.

 

n適用產品變化,以及非標準的晶片取放製程,如光學玻璃,PCBQFN等等

Applicable to product changes, and non-standard wafer transfer process, such as optical glass, PCB, QFN, etc.

 

 

Die Sorter-12" wafer 全自動

Ø12吋晶圓系列 / 12”wafer series
 
l全自動,可對應8~12晶圓及2~4tray

Fully automatic, correspond to 8 ~ 12 inch wafer and 2 to 4 inch tray.

 

l應用於一般裸晶(bare die)及驅動IC(Driver IC)

Used in the general bare die and Driver IC.

 

l高速產出(cycle time =0.45 sec)

High speed output (cycle time = 0.45 sec).

 

線材自動化設備 -電源線(Power cord)全自動生產線

 
Ø線材自動化設備
-電源線(Power cord)全自動生產線
Wire automation equipment - power cord (Power cord) automatic production line
Ø分為ABC/ Divided into ABC segment
lA: 線卷送線,裁切長度,剝皮,分線,打

A section: wire feed line, cutting length, peeling, sub-line, hit the terminal.

 

lB:傳送,插入模具,射出,脫

B section: transfer, insert the mold, injection, stripping.

 

lC: 電測,分類,包裝

C section: electrical measurement, classification, packaging.

線材自動化設備應用

 
Ø線材自動化設備應用/Application of wire automation equipment
 
Ø3C產品、車用電子、均為線材之應用場合 / All wire cable applications for 3C products, automotive electronics.
l電子產品內部

Interior wire cable of electronic product.

 

l電子產品外部

External wire cable of electronic product.

 

l工業用訊號(大數據、視覺訊號)傳輸線銷售

Industrial signal (large data, visual signal) transmission line sales.

 

Ø目前人力為主要生產模式,產線自動化有益於企業提高產能,品質穩定 / The current manpower as the main mode of production, production line automation is conducive to enterprises to improve production capacity, quality and stability.

手機攝像模組(CCM)封裝設備

 

Ø手機攝像模組(CCM)封裝設備 / Mobile phone camera module (CCM) packaging equipment

 

Ø自行開發之ACIP製程 / Self-developed ACIP process

 

lAuto Clean Inspection Package 連線設備

 All in one, auto Clean Inspection Package equipment.

  

l組合晶片清潔,晶片檢查,光學玻璃或Lens Holder封合等功能設備,建構全自動化封裝線

 Combination die cleaning, die inspection, optical glass or Lens Holder sealing and other functional equipment, the construction of fully automated packaging line.

  

l最高潔淨度及良率之架構

 The highest cleanliness and yield structure.

 

SFP+/QSFP/RJ45 Switch測試機

 

 

ØSFP+/QSFP/RJ45 Switch測試/ SFP+/QSFP/RJ45 Switch testing equipment.

 

l適用SFP+/QSFP/RJ45測試插頭 、自動旋轉插頭

Applicable SFP + / QSFP / RJ45 test plug, automatic rotation test plug.

 

l以雙CCD為位置定位依據,確保插頭插入位置精準無誤

Make sure the correct position based on double CCD, to ensure that the plug inserted position accurate and correct.

 

l自動尋找插座位置,減少程式設置時間及人員誤動作機會

Automatically find the location of the socket, reduce the program set up time and staff malfunction.

 

l插頭具自動潰縮設計,確保插頭過行程造成的損壞

The plug is designed to avoid plug crushed by the stroke.

 

l可根據客戶需求改變設計

According to customer needs to change the design.

 

視覺系統自動化設備客製

 
Ø視覺系統自動化設備 /Visual system automation equipment
l採用自主開發之視覺應用軟體

Using self-developed visual application software.

 

l彈性化、客製化之功能整合

Flexible, customization of the functional integration.

 

l可應用於定位、量測、檢查、辨識

Can be applied to positioning, measurement, inspection, identification etc...